| Titolo | Impact of package parasitics on the EMC performance of smart power SoCs |
| Publication Type | Conference Paper |
| Year of Publication | 2009 |
| Authors | Merlin, M., and F. Fiori |
| Conference Name | European Microelectronics and Packaging Conference (EMPC 2009) |
| Date Published | 06/2009 |
| Keywords | electromagnetic compatibility, electromagnetic interference, EMC, EMI, IC electromagnetic emission, on-chip parasitic capacitors, package parasitic elements, power integrated circuits, silicon substrate, smart power, SoC, system-on-chip |
