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Analysis of failure mechanisms in velocity-matched distributed photodetectors

TitleAnalysis of failure mechanisms in velocity-matched distributed photodetectors
Publication TypeJournal Article
Year of Publication1999
AuthorsNespola, A., T. Chau, M. C. Wu, and G. Ghione
JournalOptoelectronics, IEE Proceedings -
Volume146
Pagination25 -30
Date Publishedaug
ISSN1350-2433
Keywords3D numerical electrothermal model, catastrophic failure, distributed detector, failure mechanisms, highly localised hot spot, increasing bias voltage, long-wavelength velocity-matched distributed photodetectors, metal-semiconductor-metal photodiodes, metal-semiconductor-metal structures, nonlinear thermal properties, nonuniform temperature rise, photodetector, photodetectors, photodiodes, self heating, semiconductor device models, semiconductor device reliability, thermal behaviour, thermal conductivity, thermal-runaway process, three-dimensional numerical electrothermal model, velocity-matched distributed photodetector
DOI10.1049/ip-opt:19990457
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