ISMB participates at Mecha-Tronika 2013 within the stand MESAP

From 23rd to 25th October the researchers Luca Pilosu and Guido Gavilanes attended the Mecha-tronika fair 2013.

The participation within the stand MESAP, allowed to present the activities of the Multi Layer Wireless solutions (MLW) on manufacturing in particular the results of several projects both in terms of wireless transmissions in industrial environments (AMICO, ZVEI, MACP4LOG, MS-ALOHA, ...) and image processing applied to manufacturing that for the image processing applied to manufacturing (Terafly, ...).

From design to manufacturing, from purchasing to assembly, from installation to control, from energy saving to environmental sustainability, from assistance to waste disposal, the competitiveness of the manufacturing product is the result of the many competencies that make it possible to manage the process chain in mechatronic terms. A wide range of intelligences, of which MECHATRONIKA is the expression so thus to guarantee that demand and offer find their most qualified meeting point.