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Filters: First Letter Of Keyword is S and Autore is Vecchi, G.  [Clear All Filters]
Conference Paper
Vipiana, F., M. Sabbadini, and G. Vecchi, "A wavelet representation of the far field of hexagonal lattice arrays", Antennas and Propagation Society International Symposium, 2004. IEEE, vol. 1, pp. 575 - 578 Vol.1, june, 2004.
Vipiana, F., P. Pirinoli, and G. Vecchi, "Wavelet-MoM analysis of 3D antennas with triangular mesh", Antennas and Propagation Society International Symposium, 2004. IEEE, vol. 2, pp. 1471 - 1474 Vol.2, june, 2004.
Journal Article
Andriulli, F. P., H. Bagcı, F. Vipiana, G. Vecchi, and E. Michielssen, "Analysis and Regularization of the TD-EFIE Low-Frequency Breakdown", IEEE Transactions on Antennas and Propagation, vol. 57, no. 7, pp. 2034 -2046, 07/2009.
Vipiana, F., M. A. Francavilla, and G. Vecchi, "EFIE Modeling of High-Definition Multiscale Structures", Antennas and Propagation, IEEE Transactions on, vol. 58, no. 7, pp. 2362 -2374, 07/2010.
Vipiana, F., A. Polemi, S. Maci, and G. Vecchi, "A Mesh-Adapted Closed-Form Regular Kernel for 3D Singular Integral Equations", IEEE Transactions on Antennas and Propagation,, vol. 56, no. 6, pp. 1687 -1698, 06/2008.
Vipiana, F., P. Pirinoli, and G. Vecchi, "A multiresolution method of moments for triangular meshes", Antennas and Propagation, IEEE Transactions on, vol. 53, no. 7, pp. 2247 - 2258, july, 2005.
Vipiana, F., and G. Vecchi, "A Novel, Symmetrical Solenoidal Basis for the MoM Analysis of Closed Surfaces", IEEE Transactions on Antennas and Propagation, vol. 57, no. 4, pp. 1294 -1299, 04/2009.
Andriulli, F. P., G. Vecchi, F. Vipiana, P. Pirinoli, and A. Tabacco, "Optimal a priori clipping estimation for wavelet-based method of moments matrices", Antennas and Propagation, IEEE Transactions on, vol. 53, no. 11, pp. 3726 - 3734, nov., 2005.
Bagcı, H., F. P. Andriulli, F. Vipiana, G. Vecchi, and E. Michielssen, "A Well-Conditioned Integral-Equation Formulation for Efficient Transient Analysis of Electrically Small Microelectronic Devices", Advanced Packaging, IEEE Transactions on, vol. 33, no. 2, pp. 468 -480, 05/2010.

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